Analysis of the causes of component displacement in SMT chip processing
The main purpose of SMT chip processing is to accurately install surface mount components on a fixed position on the PCB, and some process problems sometimes occur during the chip processing process, which affect the quality of the chip, such as the displacement of the components. The displacement of components in the patch processing is a foreshadowing of several other problems in the welding process of component plates, which needs to be paid attention to. So what is the reason for the displacement of components in SMT processing? The editor of Dongguan SMT SMT processing manufacturer will analyze and introduce for you.
SMT chip processing
Reasons for component displacement in SMT processing:
1. The use time of solder paste is limited. After the use period is exceeded, the flux in it will deteriorate and the soldering will be poor.
2. The viscosity of the solder paste itself is not enough, and the components oscillate and shake during transportation, which causes the components to shift.
3. The flux content in the solder paste is too high, and the excessive flux flow during the reflow soldering process will cause the components to shift.
4. The components are shifted due to vibration or incorrect handling during the handling after printing and placement.
5. During the patch processing, the air pressure of the suction nozzle is not adjusted properly, and the pressure is not enough, causing the components to shift.
6. The mechanical problems of the placement machine have caused the wrong placement of the components.
Once the component shift occurs in the patch processing, it will affect the performance of the circuit board. Therefore, it is necessary to understand the cause of the comp