Basic requirements of wiring in high-speed PCB design

Basic requirements of wiring in high-speed PCB design (1) the outlet of rectangular pad of 1)QFP, SOP, etc. package should be led out from the PIN center (generally, shape is used).
(2) The distance from the wiring to the board edge is not less than 20MIL. )
(3) Other network vias and surface wiring are not allowed under metal shell devices (common metal shells include crystal oscillator, battery, etc.))
(4) Except the DRC error caused by the package itself, there must be no DRC error in the wiring, including the DRC error of the network with the same name, except for the compatible design.
(5) There is no unconnected network after the completion of PCB design, which is consistent with the PCB network and circuit diagram list.
(6) Dangline Line is not allowed.
(7) If it is clear that there is no need to keep the non-functional pad, it must be removed from the photo file.
(8) In the design of high-speed pcb, it is recommended that the distance from wiring to board edge is greater than 2MM.
(9) High-speed pcb design suggests that inner wiring should be preferred for signal lines.
(10) It is recommended that the corresponding power plane or ground plane in the high-speed signal area be kept as complete as possible.
(11) It is suggested that the wiring should be evenly distributed, and the large area without wiring needs auxiliary copper, but the requirement does not affect the impedance control.
(12) It is recommended that all wiring should be chamfered, and the chamfer angle is recommended to be 45 degrees.
(13) It is suggested to prevent signal lines from forming self-loops with side length exceeding 200MIL in adjacent layers.
(14) It is suggested that the wiring directions of adjacent layers should be orthogonal.
Note: In the design of high-speed pcb, the wiring of adjacent layers should avoid going in the same direction, so as to reduce the crosstalk between layers. If it is inevitable, especially when the signal rate is high, it should be considered to isolate each wiring layer by ground plane and each signal line by ground signal.