China is the global electronic product manufacturing center and the global electronic product consumption market, which provides sufficient market depth for the domestic PCB industry. At the same time, domestic PCB enterprises still have obvious competitive advantages due to the advantages of complete PCB industry chain and sufficient labor resources.
What should aluminum substrate manufacturers pay attention to? First, the common structure of metal substrate metal substrate, the common structure is 1: conductive layer (also known as copper foil layer), used for circuit layout and component pad location; 2. Insulation and heat dissipation layer (commonly ceramic powder PP glue), as the name implies, exerts insulation and heat dissipation effect. 3. Metal base layer (commonly aluminum-based and copper-based), as the carrier of copper foil and insulation layer, aluminum-based leads the market share of metal substrates with high cost performance and good machining performance. Second, Changsha aluminum substrate manufacturer tells you the conventional performance of aluminum substrate. As a common PCB for LED lighting lamps, we are interested in knowing more about aluminum substrate. Aluminum substrate is made of aluminum alloy, and its thermal, electrical and mechanical properties are particularly important. Common parameters such as: specific heat capacity, thermal conductivity, melting point range, linear expansion coefficient, electrical conductivity, resistivity, hardness, fatigue strength, tensile strength, elastic modulus, elongation, cutting force, etc. When it meets the national standard, the thermal conductivity is especially important. At present, the thermal conductivity of aluminum-based copper clad laminate produced by different PCB manufacturers is quite different. According to the above measurement method, the thermal conductivity of the mainstream aluminum-based copper clad laminate in the domestic market is mostly between, and the difference in cost will easily lead to unequal thermal conductivity. Therefore, when considering the thermal conductivity, it is advisable to refer to the aluminum substrate price positioning and third-party testing.
Common PCB layout problems and puzzles
Whether a product is successful or not, on the one hand, requires good functional quality, and on the other hand, requires beautiful appearance. You should lay out your circuit board like carving a handicraft. These questions and troubles often arise in the layout of PCB components.
Do you need to make up the PCB, reserve the process edge, reserve the mounting holes, and how to arrange the positioning holes?
Is PCB shape matched with the whole machine? Is the distance between components reasonable, and is there any conflict in level or height?
How to consider impedance control, signal integrity, power signal stability and power module heat dissipation?
Is the distance between the heat-sensitive element and the heat-generating element considered?
Overall EMC performance, how can layout effectively enhance anti-interference ability?
Are the components that need to be replaced frequently convenient to replace, and the adjustable components convenient to adjust? PCB
The main factors that affect the flexibility of FPC materials are the type of materials and the thickness of materials. The molecular structure and direction of copper foil, the folding resistance of rolled copper is obviously better than that of electrolytic copper foil; As far as the same variety is concerned, the thinner the thickness of copper foil, the better its folding resistance will be; Generally speaking, the softness of epoxy resin glue is better than that of acrylic glue, and epoxy is the main material with high flexibility. The thinner the glue thickness, the better the flexibility of the material, which can improve the flexibility of FPC. The thinner the thickness of the base material PI, the better the flexibility of the material, and the higher the flexibility of FPC. The better the flexibility of FPC is when PI with low tensile touch is selected.