However, compared with developed countries, China’s developing PCB automation equipment industry still has a certain gap. However, among developing countries, China is the largest and most complete country with the strongest comprehensive strength in PCB automation equipment industry. When well-known foreign PCB automation equipment enterprises take root in China, even with the continuous progress of new technologies and processes, PCB automation equipment is constantly developing, constantly bringing forth the old and bringing forth the new, and constantly improving the intelligence level, Chinese enterprises are still facing more and more challenges. When the domestic PCB automation equipment market is becoming more and more saturated, it is urgent for domestic PCB automation equipment enterprises to find a bigger and wider international market and a new market breakthrough. Nowadays, the globalization and integration of the world economy are developing rapidly, and the competition in the international market is becoming increasingly fierce. It has become an inevitable trend for our PCB automation equipment enterprises to go to the international market. However, in the last century, the era when one computer and one translation software could travel all over the world has disappeared forever. Nowadays, the internationalization route of enterprises should be more systematic and professional. It is necessary to study the international market carefully, understand the development trend of the international market, find out their position in the market, and make their products professional and brand-oriented. Only in this way can we actively and steadily explore the international market.
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Generally, the manufacturing method of multi-layer circuit board manufacturers is that the inner layer pattern is made first, then the single-sided or double-sided substrate is made by printing and etching method, which is incorporated into the specified interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through hole method of double-sided panel. It was invented in 1961. Advantages of multi-layer circuit board manufacturers: high assembly density, small volume and light weight. Because of the high assembly density, the connections between components (including components) are reduced, thus improving the reliability; The number of wiring layers can be increased, thus increasing the design flexibility; Can form a circuit with a certain impedance; Can form a high-speed transmission circuit; The shielding layer of circuit and magnetic circuit can be set, and the metal core heat dissipation layer can also be set to meet the needs of special functions such as shielding and heat dissipation. Simple installation and high reliability. Disadvantages: high cost; Long period; High reliability detection means are needed. Multilayer printed circuit is the product of the development of electronic technology towards high speed, multifunction, large capacity and small volume. With the continuous development of electronic technology, especially the extensive and in-depth application of VLSI, multi-layer printed circuit is rapidly developing towards high density, high precision and high-level digitalization. Some technologies such as fine lines, small aperture penetration, blind hole burying and high board thickness aperture ratio have appeared to meet the market demand. Difference between multilayer PCB and double panel Multilayer circuit board is a kind of printed circuit board, which consists of alternating conductive pattern layers and insulating materials laminated and bonded. The number of conductive patterns is more than three, and the electrical interconnection between layers is realized through metallized holes. If a double panel is used as the inner layer, two single panels are used as the outer layer, or two double panels are used as the inner layer and two single panels are used as the outer layer, and the conductive patterns are laminated together by a positioning system and insulating adhesive materials, and the conductive patterns are interconnected according to the design requirements, four-layer and six-layer printed circuit boards, also known as multilayer pcb circuit boards, are formed. Compared with the general production process of multilayer board and double-sided board, the main difference is that multilayer board has added several unique process steps: inner layer imaging and blackening, lamination, concave etching and de-drilling. In most of the same processes, some process parameters, equipment precision and complexity are also different. For example, the inner metallization connection of multilayer board is the decisive factor for the reliability of multilayer board, and the quality requirements of hole wall are stricter than those of double-layer board, so the requirements for drilling holes are higher. In addition, the number of laminated plates for each drilling, the rotation speed and feed rate of the drill bit are different from those of double-faced plates. The inspection of finished and semi-finished products of multilayer board is much stricter and more complicated than that of double-panel board. Due to the complex structure of multilayer board, glycerin hot-melt process with uniform temperature should be adopted, instead of infrared hot-melt process which may lead to excessive local temperature rise.