In fact, the micro-assembly technology of SMT proofing and small batch processing is a comprehensive technology of assembling various micro-components of electronic circuits on high-density multilayer interconnected substrates by micro-welding and SMT chip processing to form micro-electronic products.
I. Multi-chip module
The multi-chip component in SMT package is a kind of high-tech electronic product derived from the hybrid integrated circuit. This technology assembles a number of LSI and VLSI chips on a hybrid multilayer interconnection substrate at high density, and then packages them into a shell. It is a highly hybrid integrated component. The interconnection and assembly technology of MCM chips processed by SMT proofing in small batch is to assemble components and devices on MCM substrate in a specific connection mode, and then install the substrate on which the components are assembled in a package to form a multifunctional MCM assembly. MCM interconnection assembly technology includes: bonding between chip and substrate, electrical connection between chip and substrate, physical connection and electrical connection between substrate and shell.
Second, flip-chip FC technology
The flip chip technology of SMT proofing small batch processing is to realize the interconnection between the chip and the circuit board through the bumps on the chip. Generally, the chip is placed on the circuit board in reverse. Generally, gold wire bonding technology uses the peripheral parts of the chip, while flip-chip solder bump technology uses the whole chip surface, which can make the packaging density of flip-chip technology higher and reduce the size of the device. Flip-chip technology in SMT package includes: solder paste flip-chip assembly process, solder bump flip-chip bonding method, controllable collapse connection C4 technology.
Third, packaging and stacking
The emergence of PoP stacking assembly technology in SMT packaging materials blurs the boundary between primary packaging and secondary assembly, which not only improves the logical operation function and storage space, but also provides the end user with the possibility of freely selecting device combinations, thus controlling the production cost. The main function of PoP package is to integrate high-density digital or mixed-signal logic devices in the bottom package and high-density or combined memory devices in the top package.
IV. Photoelectric interconnection technology
1. Optoelectronic board-level package SMT proofing The optoelectronic board-level package processed in small batches is to integrate optoelectronic devices with electronic packages to form a new board-level package. This board-level package can be regarded as a special multi-chip module which includes optical circuit substrate, optoelectronic devices, optical waveguides, optical fibers, optical connectors and other devices.
2. Optoelectronic components and modules Optoelectronic components and modules Optoelectronic circuit components or modules formed by optoelectronic packaging technology can make copper conductors for transmitting electrical signals and optical paths for transmitting optical signals on one substrate.
3. Hierarchical structure of optical circuit assembly. Optical circuit assembly generally consists of six hierarchies. Chip level, device level, MCM level, board level, component level and system level.