PCB design instruction of haisi chip
Through the study of HiSilicon, referring to its chip data, combined with the design experience of HiSilicon-related products, and based on our general PCB design instruction, our company organized senior design engineers to specially sort out the PCB design of HiSilicon-related products and conduct centralized review. Recently, our company’s PCB Design Guide for HiSilicon Chip was officially finalized and released, which is used to guide and standardize the increasing number of PCB designs involving HiSilicon chips in our company, so as to better serve customers.
This guide book systematically and comprehensively introduces all aspects of HiSilicon PCB design, mainly including the following contents:
1. Introduction of HiSilicon Chip
Second, the type of HiSilicon chip
Third, the single board architecture of HiSilicon chip
IV. Layout design of HiSilicon chip
V. Wiring Requirements of HiSilicon Chip
VI. Lamination Design Requirements of HiSilicon Chip
With the release of our Hisilicon PCB design guide, we will carry out systematic training and learning work within the company, and provide excellent service for our Hisilicon chip products customers with more exquisite technology.