Nowadays, the use of PCB multilayer circuit boards in the market has become a popular trend, and with the development of the industry, the ability of many PCB manufacturers to develop and produce PCB multilayer circuit boards has become increasingly prominent. So, what are the requirements for the proofing of PCB multilayer circuit boards? Below, Xiaobian will analyze it for everyone:
1, the requirements of clean appearance. When proofing a multilayer PCB, it is necessary that the appearance of the sample is flat, there are no burrs at the corners, and there will be no blistering and delamination between the wires and the solder resist film. Only in this way, can PCB multilayer circuit boards ensure better soldering effect, and at the same time, can PCB multilayer circuit boards produced by PCB manufacturers meet the appearance requirements of actual use.
2. Requirements for reasonable process. Before proofing, it is also necessary to study whether the process of PCB multilayer circuit board is reasonable, such as whether there is mutual interference between circuits, etc., so as to ensure the long-term and stable operation of PCB multilayer circuit board.
3. Requirements of CAM optimization. If you want to obtain high-quality PCB multilayer circuit boards, you need to carry out relevant CAM processing during proofing. This treatment includes adjusting the line width, optimizing the spacing and bonding pads, etc., to ensure that the circuit interaction between PCB multilayer boards has good signals and make the quality of the template more superior.
These are the basic requirements of PCB multilayer circuit board proofing. High-quality proofing can make PCB multilayer circuit board have higher quality, and mass production can be carried out after ensuring the quality is correct. Therefore, reasonable design planning of PCB multilayer circuit board as required is also for better production of PCB multilayer circuit board.