Pcb circuit boards that provide power supply are almost all called power boards, and power boards are machine boards that mainly deal with power supply initiating functions. The smt process flow of power board can be basically divided into three processes: automatic mounting of SMT components, wave soldering plug-in, and manual operation. Then, what are the process requirements of the power board in the process of chip mounting?
1. First, the temperature resistance requirements of the power board pcb, whether it meets the level required by customers; Whether it conforms to the lead-free process; Whether the board is blistered or not, especially the technological requirements of adhesive paperboard should be paid more attention to.
2. The temperature resistance of Smt chip processing devices can fully meet the requirements of the soldering temperature of board parts (40-90 seconds above 222 degrees; Withstand temperature above 245 degrees). If customers have special requirements, they should inform and provide information in advance.
3. The distance between parts of the power panel during patch processing should not be less than 1mm between large and small materials, and the distance between materials below 0805 should be greater than 0.3mm
4. Pad design requirements for smt chip processing. There should be no wire passing holes in the pad, no solder leakage holes in the edge of the component pad, and the circuit design of the power board should meet the packaging requirements of the device.
5. Half of the power board requires that there should be no gap on the transmission side.
In order to achieve higher accuracy in pcba manufacturing process of power board, the process flow of PCBA processing and double-sided surface assembly of power board is as follows: A-side printing solder paste-patch-reflow soldering-turning plate-B-side printing solder paste-patch-reflow soldering.