Several trends of PCB technology development and innovation in Hunan PCB factory

With the rapid development of electronic technology, PCB manufacturers can only find a way out in the highly competitive PCB industry by actively developing and innovating production technology on the basis of recognizing the development trend of PCB technology. PCB manufacturers should always keep a sense of development. Here are some views on the development of PCB production and processing technology in Changsha: 1. Developing component embedding technology is a great change of functional integrated circuit of PCB. Forming semiconductor devices (called active components), electronic components (called passive components) or passive components in the inner layer of PCB “component embedding PCB” has started mass production. However, to develop PCB manufacturers, we must first solve the analog design method, production technology and check the quality and reliability. Changsha PCB Factory needs to invest more resources in the system including design, equipment, testing and simulation to keep strong vitality. Several trends of PCB technology development and innovation in factory. 2. HDI technology is still the mainstream development direction. HDI technology promotes the development of mobile phones, drives the development of LSI and CSP chips (packages) with information processing and basic frequency control functions, and also promotes the development of PCB. Therefore, PCB manufacturers should innovate PCB production and processing technology along HDI road. Because HDI embodies the most advanced technology of contemporary PCB, it brings fine wiring and tiny aperture to PCB. Mobile phone (mobile phone), one of the electronic products of HDI multilayer board application terminal, is a model of HDI frontier development technology. In mobile phones, the fine wires (50μ m ~ 75μ m/50μ m ~ 75μ m, wire width/spacing) of PCB main board have become the mainstream, in addition, the thickness of conductive layer and board has been shaped; Micro-thinning of conductive patterns brings high density and high performance of electronic equipment.
3. Continuously introduce advanced production facilities and update circuit board manufacturing technology. HDI manufacturing is mature and tends to be perfect. With the development of PCB technology, although the commonly used subtractive manufacturing method is still dominant in the past, low-cost technologies such as additive process and Semi-additive process are emerging. A new method of manufacturing flexible board by using nanotechnology to metallize holes and form PCB conductive patterns. High-reliability, high-quality printing method and inkjet PCB process. Production of fine wires, new high-resolution photo masks and exposure devices and laser direct exposure devices. Uniform plating equipment. Equipment and facilities for manufacturing and installing embedded components (passive active components).
Several trends of PCB technology development and innovation in the factory. 4. Developing PCB raw materials with higher performance, whether rigid PCB or flexible PCB, with the global lead-free electronic products, it is required to make these materials have higher heat resistance, so new materials with high Tg, small thermal expansion coefficient, small dielectric constant and better dielectric loss are constantly emerging. 5. Optoelectronic PCB has a bright future. Optoelectronic PCB circuit board uses optical circuit layer and circuit layer to transmit signals. The key of this new technology is to manufacture optical circuit layer (optical waveguide layer). It is an organic polymer, which is formed by lithography, laser ablation, reactive ion etching and other methods. At present, this technology has been industrialized in Japan and the United States. As a big producing country, China’s PCB manufacturers should also actively respond and keep up with the development of science and technology.