Nowadays, the rapid development of all walks of life and the rapid development of science and technology have promoted the great development of electronic products and the rapid development of SMT chip proofing. However, in this uneven industry, there will inevitably be some enterprises that cannot guarantee the quality of SMT chip proofing. In fact, it is not advisable to sacrifice quality in exchange for low-cost processing. A processing enterprise must have the spirit of artisans. The good selling of a board can’t all be attributed to the good marketing, but rather the good processing quality of this PCBA board.
How to control the quality of SMT chip proofing processing in small batch SMT chip processing factory. To control the processing quality of SMT patches, some necessary conditions should be met:
1. Complete incoming inspection and confirmation process, and strictly control the materials.
Two, the new model production project team, for new customers for the first time production quality checks.
III. Nitrogen process and device storage, for pcba customers with high requirements and high precision.
IV. Environmental monitoring of SMT mounting workshop: 25 plus or minus 2 degrees, relative humidity: 40%-60%.
5. SMT accessories use high-quality solder paste to ensure the welding quality and stability of SMD.
VI. Professional technical team, with engineers/technicians working experience in smt industry for more than 10 years.
VII. The equipment adopts high-precision mounter, with the minimum mounter of 0201, to ensure the accuracy and efficiency of SMT mounter.
Eight, strict SOP production process control, SMT patch, DIP welding and back-end assembly test.
IX. Reflow soldering with 10-temperature zone is selected to ensure the quality of reflow stage, and various types of PCBA products should be handled.
X. The first article confirmation process is rigorous, and the final version is confirmed with the customer by comparing PCB drawings, PCBA samples, etc.
XI. Management and control of SMT chip processing and production process: solder paste viscosity detection, solder paste printing thickness detection, chip precision detection, before-furnace mounting detection, after-furnace regular sampling inspection, after-furnace AOI full inspection, and finished product inspection.