Today’s mass-produced electronic hardware is manufactured using well-known surface mount technology or SMT. There is no reason! In addition to providing many other advantages, SMT wireless charging board S for mobile phones still has a long way to go in speeding up the production speed of wireless charging board for mobile phones.
SMT（Surface Mount Technology）
Essentially, surface mount technology (SMT) adopted the basic concept of through-hole manufacturing, and continued to make significant improvements. When SMT is used, the wireless charging circuit board of mobile phone does not need to be drilled. Instead, what they have to do is make use of solder paste. In addition to increasing the speed, this significantly simplifies the process. Although SMT mounting components do not have the strength of through-hole mounting components, they provide many other advantages that can offset this problem.
Surface mount technology goes through the following five steps:
1. production of mobile phone wireless charging circuit board-this is the stage of actually producing mobile phone wireless charging circuit board with solder dots.
2. Deposit solder on the pad to fix the component to the board.
3. With the help of the machine, place the components on the precise solder joints.
4. Bake the mobile phone wireless charging circuit board to harden the flux.
5. Check the finished components.
The reasons that make SMT different from through holes include:
Surface mount technology can be used to solve the space problem in through-hole installation. SMT also provides design flexibility, because it provides designers of mobile phone wireless charging boards with free control to create dedicated circuits. The reduced component size means that more components can be accommodated on one board, and fewer boards are needed.
Components in SMT installation are lead-free. The lead length of surface mount components is shorter, which can reduce propagation delay and packaging noise.
The density of components per unit area is higher because it allows components to be installed on both sides.
It is suitable for mass production, thus reducing the cost.
The reduction of size leads to the increase of circuit speed. In fact, this is one of the main reasons why most manufacturers choose this method.
The surface tension of the molten solder pulls the assembly to the position aligned with the pad. In turn, this will automatically correct any minor errors that may occur in component placement.
It has been proved that SMT is more stable in the presence of a lot of vibration or shaking.
SMT parts are usually cheaper than similar through-hole parts.
Importantly, SMT can greatly shorten the production time because there is no need to drill holes. Moreover, SMT components can be placed in thousands per hour, while the placement speed of through-hole installation is less than one thousand. In turn, this leads to the expected speed of product production, thus further shortening the time to market. Therefore, if you want to speed up the production time of mobile phone wireless charging circuit board, then SMT is undoubtedly the answer. By using DFM software tools, the need to rework and redesign complex circuits can be greatly reduced, thus further improving the speed and the possibility of complex design.
All this does not mean that SMT has no inherent shortcomings. If SMT is used as the only fixing method for components facing a lot of mechanical stress, SMT may not be reliable. Components that generate a lot of heat or bear high electrical load cannot be installed by SMT. This is because the solder will melt at high temperature. Therefore, in the case of SMT failure caused by special mechanical, electrical and thermal factors, through-hole installation is likely to continue. Similarly, SMT is not suitable for prototyping, because components may need to be added or replaced during prototyping, and high-density circuit boards may be difficult to support.