Why should high TG materials be used in PCB production in Changsha?

Why should high TG materials be used in PCB production in Changsha? In addition to the basic FR-4 materials in pcb production, some customers also indicate that they want to use high TG materials in their materials, so why use high TG materials in PCB production? The full name of TG used in PCB manufacturing is glasstransitiontemperature, which stands for glass transition temperature. The circuit board must be flame-resistant. It cannot burn at a certain temperature, but can only be softened. At this time, the temperature point is called the glass transition temperature (Tg point), which is related to the dimensional stability of PCB. The higher the Tg value, the better the temperature resistance of TgPCB. When the temperature rises to a certain area, the substrate will change from “glass state” to “rubber state”, which is called the glass transition temperature of sheet (TG). In other words, Tg is the highest temperature (℃) at which the temperature of the substrate is kept. That is to say, at high temperature, common PCB substrate materials not only produce phenomena such as stretching deformation and melting, but also drastically reduce mechanical properties and electrical characteristics. Why should high TG materials be used in PCB production in Changsha? With the increase of Tg of substrate, the characteristics of heat resistance, moisture resistance, chemical resistance and resistance stability of Shenzhen PCB proofing will be strengthened and improved. The higher the Tg value, the better the temperature and other properties of the board, especially in the lead-free manufacturing process. High TG is widely used. High Tg refers to high heat resistance. With the rapid development of electronic industry, especially the electronic products represented by computers, which are developing towards high functionality and multi-layers, higher heat resistance of PCB substrate materials is needed as an important guarantee. With the emergence and development of high-density mounting technology represented by SMT and CMT, PCB is increasingly inseparable from the support of high heat resistance of the substrate in terms of small aperture, fine wiring and thinness. This is also a big reason why high TG materials are used in pcb manufacturing. Therefore, in pcb manufacturing, the difference between general FR-4 and high Tg FR-4 is that the mechanical strength, dimensional stability, adhesion, water absorption, thermal decomposition, thermal expansion and other conditions of the materials are different in hot state, especially when heated after moisture absorption. The high Tg products are obviously better than ordinary PCB substrate materials.