When we use the flexible printed circuit board, do you know its basic structure? Do you know what it is made of? Let’s split it to give you a simple understanding of the basic structure of flexible printed circuit board.
1. copper foil substrate (Copper Film)
Copper foil: basically divided into electrolytic copper and rolled copper. The common thicknesses are 1oz 1/2oz and 1/3 oz.
Substrate: Common thicknesses are 1mil and 1/2mil.
Glue (adhesive): The thickness is determined according to customer’s requirements.
2. Cover Film (cover film)
Cover protective film: for surface insulation. Common thicknesses are 1mil and 1/2mil.
Glue (adhesive): The thickness is determined according to customer’s requirements.
Release paper: to avoid the adhesive sticking to foreign substances before pressing; Easy to work.
3. Reinforcing plate (PI Stiffener Film)
Reinforcing board: Reinforcing the mechanical strength of FPC, which is convenient for surface mounting. The common thickness is 3mil to 9mil.
Glue (adhesive): The thickness is determined according to customer’s requirements.
Release paper: to avoid the adhesive sticking to foreign matter before pressing.
EMI: Electromagnetic shielding film, which protects the circuit in the circuit board from external interference (strong electromagnetic area or susceptible area).
The basic structure of flexible printed circuit board’s understanding has an understanding of our understanding of flexible printed circuit board. The above is a brief introduction. We welcome any simple understanding that is necessary.