Underfilling of pcb is a technology that is often used in electronic industry. In order to meet some special dispensing requirements, the initial underfilling technology of pcb is to meet the production of ceramics. With the development of technology, it is gradually applied to chip packaging of PCB, and then the chip is glued to PCB by dispensing equipment. However, PCB dispensing requires high equipment requirements, so it needs to be applied to high-speed filling dispenser.
High-speed dispensing machine is also a mature equipment, which has a high advantage in dispensing speed, and can dispense, coat and package products. Basically, no dispensing machine can surpass its speed, and has a high speed. Other dispensing technologies are also very good, and the high requirements of PCB dispensing can still be met, otherwise, high-speed dispensing machine can’t use underfill technology.
The underfill technology is very suitable for the current electronic industry production. Other methods can’t meet the needs of PCB glue spraying, and then the underfill technology is gradually adopted. At first, there is no expectation of the underfill technology from enterprises. Just try to get the desired result and try the dispensing effect, but the final result surprised everyone, and then this technology was gradually popularized.
Packaging, PCB glue spraying requires strict glue spraying technology, and it also requires high production speed. The faster the production speed, the more benefits the enterprise can win. There are not many glue dispensers that can meet these conditions. The high-speed filling glue dispenser is one of them, while other glue dispensers only have speed or precision. Soon, the high-speed filling glue dispenser will appear. The glue spraying effect of using this kind of glue dispenser is very good, and the produced PCB board effect is also quite good.