Author Archives: allaismt

Why should high TG materials be used in PCB production in Changsha?

Why should high TG materials be used in PCB production in Changsha? In addition to the basic FR-4 materials in pcb production, some customers also indicate that they want to use high TG materials in their materials, so why use high TG materials in PCB production? The full name of TG used in PCB manufacturing […]

PCB proofing oxidation resistance manufacturing process

Anti-oxidation of PCB is to coat the specified metal surface (hole and board) with an anti-oxidation organic film, namely organic solderability protection (DSP). Glicoat SMDLF2 is one of them, which maintains its solderability in the thermal cycle of forming a firm leveling technology on the metal surface of the printed board through the chemical reaction […]

What is the tolerance of Hunan multilayer PCB design?

Multi-layer PCB is beneficial to products because they can handle greater complexity. Computers, telephones and medical equipment are some application examples that benefit from multi-layer design. However, the use of multilayer printed circuit boards will become a key problem to connect these layers to each other. If you don’t connect each layer to the corresponding […]

Production efficiency of PCB proofing

PCB proofing production is developing in the direction of high density, high precision, fine aperture, fine wire, fine pitch, high reliability, multilayer, high-speed transmission, light weight and thinness. At the same time, production is developing in the direction of increasing productivity, reducing cost and pollution, and adapting to multi-variety and small batch production. The technical […]

Detailed explanation of copper deposition process for PCB proofing in Xi ‘an

Process introduction and technical points analysis of copper deposition process for evi circuit boards Chemical copper is widely used in the production and processing of printed circuit boards with through holes. Its main purpose is to deposit a layer of copper on the non-conductive substrate through a series of chemical treatment methods, and then thicken […]

Introduction of Ink and Its Main Properties in Xi ‘an PCB Manufacturing Factory

Introduction of Ink and Its Main Properties in Xi ‘an PCB Manufacturing Factory It also plays a very important role in the production process of printed circuit board in printing ink pcb board factory. Today, Xi ‘an PCB Manufacturing Xiaobian introduces the composition and main performance of ink. The printing ink of Xi ‘an PCB […]

The higher the number of proofing layers of Xi ‘an PCB multilayer board, the better the performance?

Circuit board, which can be regarded as a miniature bearing platform, is an important carrier of integrated circuit. The appearance of PCB multilayer board allows the limited space to accommodate more and more complex circuits as much as possible. In addition, it also simplifies the difficulty of circuit layout on PCB to some extent. Many […]

Complete PCB proofing process

1. print PCB circuit board. Print the drawn circuit board with transfer paper, and pay attention to the slippery side facing yourself. Generally, two circuit boards are printed, that is, two circuit boards are printed on a piece of paper. Among them, the printed circuit board with the best printing effect is selected. 2. Cut […]

Rapid proofing of Xi ‘an multilayer impedance PCB circuit board

Fpc is also called flexible circuit board, flexible circuit board and flexible circuit board. Referred to as flexible board or fpc, FPC flexible board has the advantages of high wiring density, light weight, thin thickness, less limitation of wiring space, high flexibility, etc. compared with common hard resin circuit board. Rapid proofing of Xi ‘an […]

How to set shielding for PCB layer in Xi ‘an PCB design

In product development, from the perspective of cost, schedule, quality and performance, it is usually best to carefully consider and implement the correct PCB design as early as possible in the project development cycle. Add-ons and other “quick” patches implemented later in the project are usually not ideal solutions in function, their quality and reliability […]