Author Archives: allaismt

What is an excellent outsourcing design of PCB painting?

1, PCB painting outsourcing production requirements Clear requirements for plate thickness, copper thickness, welding resistance, character color, etc. The above requirements are the basis for making a board, so R&D engineers must write clearly. As far as the customers I have contacted are concerned, Gree has done a relatively good job, and the technical requirements […]

Outsourcing design process of circuit board

Circuit board is in English, literally translated as “printed circuit board”, as well as circuit board, PCB, PCB, etc., which is an important part of electronic equipment in the modern technology era. The appearance of circuit board provides various functions for electronic products and realizes the integration of circuits. It mainly consists of pads, holes, […]

Influence of via hole in high-speed pcb design outsourcing painting

With the rapid development of electronic industry, the increase of wiring density of high-speed pcb, the speed of frequency and switch, the corresponding requirements of outsourcing painting of high-speed PCB design are becoming more and more strict. In the outsourcing design of high-speed pcb, multilayer boards are usually used for design, so it is inevitable […]

Technical guide for outsourcing PCB design and painting

At the beginning of the new PCB outsourcing design, because most of the time is spent on circuit design and component selection, in the PCB layout stage, due to lack of experience, the consideration is not comprehensive enough. If enough time and energy are not provided for the design of PCB layout, it may lead […]

Principles to be followed in PCB design

When designing pcb, it is necessary to pay attention to such a basic situation, that is, how many wiring layers, grounding planes and power planes are needed to achieve the required functions of the circuit, and the establishment of the layers of wiring layers, grounding planes and power planes of PCB is related to the […]

In high-speed circuit design, how to deal with the cross-segmentation of signal lines in PCB design?

Disclaimer: The following methods are not applicable to all designs. Facing different designs, engineers need to choose the appropriate methods to deal with them. In the process of PCB design, high-multilayer, high-density designs are often encountered, so cross-segmentation is inevitable in this case, as shown in the following figure: This is an HDI project, which […]

Thermal management of PCB outsourcing design

As electronic products continue to be miniaturized, as more functions are loaded into smaller devices, the heat dissipation requirements of these systems also increase. This is especially true for PCBs operating at high current. Especially the power supply system with heavy load, such as lithium-ion batteries used in electric vehicles, needs a power management system […]

Prevention scheme of copper electroplating fault in PCB manufacturing

Copper sulfate electroplating plays an extremely important role in PCB electroplating. The quality of acid copper electroplating directly affects the quality and related mechanical properties of the electroplated copper layer on PCB board, and has a certain impact on the subsequent processing. Therefore, how to control the quality of acid copper electroplating is an important […]

The future development trend of SMT surface technology

The future development trend of SMT surface technology Since its inception in the mid-1960s, SMT has become the mainstream of today’s electronic manufacturing technology after more than 40 years of development, and it is continuing to develop in depth. Its development trend is mainly manifested in the following aspects: 1. Green production With the gradual […]

The development history of SMT surface technology

The development history of SMT surface technology Surface mount technology is developed from the manufacturing technology of component circuits. As early as 1957, the United States made micro-electronic components called Chip Components, which were assembled on the surface of printed circuit boards. In the mid-1960s, the Dutch Philips company successfully developed and researched surface assembly […]