Author Archives: allaismt

EMI is caused by electromagnetic interference source transferring energy to sensitive system through coupling path. It includes three basic forms: conduction through wires or common ground wires, space radiation or near-field coupling. The harm of EMI is to reduce the quality of transmission signal, cause interference or even damage to the circuit or equipment, and […]

1, PCB painting outsourcing production requirements Clear requirements for plate thickness, copper thickness, welding resistance, character color, etc. The above requirements are the basis for making a board, so R&D engineers must write clearly. As far as the customers I have contacted are concerned, Gree has done a relatively good job, and the technical requirements […]

Circuit board is in English, literally translated as “printed circuit board”, as well as circuit board, PCB, PCB, etc., which is an important part of electronic equipment in the modern technology era. The appearance of circuit board provides various functions for electronic products and realizes the integration of circuits. It mainly consists of pads, holes, […]

With the rapid development of electronic industry, the increase of wiring density of high-speed pcb, the speed of frequency and switch, the corresponding requirements of outsourcing painting of high-speed PCB design are becoming more and more strict. In the outsourcing design of high-speed pcb, multilayer boards are usually used for design, so it is inevitable […]

At the beginning of the new PCB outsourcing design, because most of the time is spent on circuit design and component selection, in the PCB layout stage, due to lack of experience, the consideration is not comprehensive enough. If enough time and energy are not provided for the design of PCB layout, it may lead […]

When designing pcb, it is necessary to pay attention to such a basic situation, that is, how many wiring layers, grounding planes and power planes are needed to achieve the required functions of the circuit, and the establishment of the layers of wiring layers, grounding planes and power planes of PCB is related to the […]

Disclaimer: The following methods are not applicable to all designs. Facing different designs, engineers need to choose the appropriate methods to deal with them. In the process of PCB design, high-multilayer, high-density designs are often encountered, so cross-segmentation is inevitable in this case, as shown in the following figure: This is an HDI project, which […]

As electronic products continue to be miniaturized, as more functions are loaded into smaller devices, the heat dissipation requirements of these systems also increase. This is especially true for PCBs operating at high current. Especially the power supply system with heavy load, such as lithium-ion batteries used in electric vehicles, needs a power management system […]

With the improvement of the integration of IC devices, the miniaturization of devices and the increasing speed of devices, the EMI problem in electronic products is becoming more and more serious. From the point of view of EMC/EMI design of system equipment, dealing with EMC/EMI problems in PCB design stage of equipment is the most […]