Author Archives: allaismt

smt assembly common faults SMC/SMD placement is a key process in the assembly and production of SMT products. Automatic placement is the main method of SMC/SMD placement. Placement machines are essential equipment in the assembly line of SMT products, as well as key equipment of SMT. It is the main factor that determines the degree […]

smt patch and its main fault 1. SMD and its main faults SMC/SMD placement is a key process in the assembly and production of SMT products. Automatic placement is the main method of SMC/SMD placement. The placement machine is an essential equipment in the assembly line of SMT products, and is also a key equipment […]

SMT processing solder paste application fault elimination countermeasures Solder paste printing is a relatively complex process technology, which is affected by both materials and printing equipment and process parameters. The soldering quality defects of most SMT products are directly or spaced from the solder paste printing process. Although the quality of solder paste printing can […]

Patch glue application failure and its application quality control countermeasures 1. SMD glue application and its main faults SMD glue is used as a bonding agent and is often used in wave soldering as the glue for SMC/SMD to be placed on the substrate. Adhesive coating can use dispenser dispensing (also known as syringe dispensing) […]

Smt product assembly failure and its types 1. Smt product assembly failure Assembly Fault (Assembly Fault) refers to faults caused by problems in the assembly process, such as solder bridge short circuit, virtual solder open circuit, wrong or missing components, and so on. In actual production, assembly failure, as the main source of failure of […]

Function test of smt assembly quality inspection Although a variety of new detection technologies emerge endlessly, such as optical and X-ray inspection, electrical performance testing based on flying probes or needle beds, etc., functional testing is still the main method to detect and ensure the final functional quality of products. At present, there are more […]

There are several smta measurement methods Typical non-vector testing methods are as follows: (1) Semiconductor junction (PN junction) test At present, when most digital integrated circuits are produced, they will consider the internal core functions and the protection factors of each signal input and output pin to ground, such as anti-static measures. In the semiconductor […]

Common problems in PCB circuit design 1. Stacking of pads 1. The stacking of pads (except surface mount pads) means the stacking of holes. During the drilling process, the drill bit will be broken due to multiple drilling in one place, resulting in damage to the hole. 2. Two holes in the multilayer board are […]

The pcba processing factory tells you what are the precautions for PCB jigsaw The following Dongguan pcba processing plant first lists 10 requirements for attention, welcome everyone to correct: 　　 1. The outer frame (clamping side) of the PCB jigsaw should use closed-loop planning to ensure that the PCB jigsaw will not be deformed in […]

The importance of DFM in the production process of SMT patch assembly According to many years of electronic production experience in Dongguan SMT processing plant, the design cost of the product accounts for more than 70% of the total production cost. The costs incurred during the specific production process, such as operating expenses, materials and […]