Category Archives: Uncategorized

“High-speed backplane and high-speed backplane connector” is mentioned in “The culprits in several high-speed PCB designs”. So how is the high-speed backplane designed? What are the design steps from beginning to end? What are the key points in each stage? The case analysis of the current period is summarized. High-speed backplane design process The detailed […]

1. Multi-layer circuit board Jafani bites copper This problem must be traced back to the copper electroplating process. It is found that if the examples of deep hole barrel plating and buried hole barrel plating with high thickness-diameter ratio can be shown that the copper thickness is more evenly distributed, this kind of Jafani’s copper […]

Definition of making high frequency circuit board High-frequency circuit board refers to a special circuit board with high electromagnetic frequency, which is used for PCB in high-frequency (frequency greater than 300MHZ or wavelength less than 1m) and microwave (frequency greater than 3GHZ or wavelength less than 0.1m) fields. It is a circuit board produced by […]

Nowadays, with people’s living standard getting higher and higher, there are more and more home appliances. Television is a very common electrical appliance in people’s daily life, and it is also an electrical appliance that almost every household has, with a very high popularization rate. So do you know what the logic board in TV […]

Nowadays, more and more circuit boards use surface mount components. Compared with traditional packaging, it can reduce the total area of circuit boards, facilitate mass production and processing, and have high wiring density. The lead inductance of chip resistor and capacitor is greatly reduced, which has great advantages in high frequency circuit. The inconvenience of […]

IGBT master control board is a kind of master control board with a power range of 15KW-120KW, which consists of a panel, a master control board and two driving boards. It is mainly used in the heat treatment industry. Introduction of IGBT main control board: The main control board of high-frequency induction heating and two […]

In the production process of batch processing of high-precision circuit boards, in order to avoid the problem of rejection and material replenishment of FPC boards caused by too many open and short circuit faults, or the reduction of rough processing problems such as punching, injection molding, laser cutting, etc., and to evaluate how to select […]

The micro-miniaturization, intelligence and intelligent system regulations of the new generation portable electronic equipment promote the application of High-DensityAssemblyPCB board (high-density assembly board) and high-density interconnection (HDI) multilayer circuit boards. The traditional manufacturing process of laminated pcb circuit board can no longer be integrated into the application of ultra-fine particle spacing components, and then the […]

It is the most popular production process in SMT electronic assembly industry, which meets the requirements of thin and mass production of mobile phones and computers. PCBA assembled by SMT patches has high relative density and light weight, and has completed mass production of automation technology. Characteristic spot welding is on the same plane as […]

The package plays the role of installation, fixation, sealing, chip protection and electric heating performance enhancement. In addition, according to the contacts on the chip, the pins are connected to the pins of the packaging case by power lines, and the pins are connected with other components according to the power lines on the printed […]