Category Archives: Uncategorized

In the production process of FPC, if you don’t pay attention to touching the PCB pads with your fingers, especially the FPC with surface treatment, it will cause oxidation. When the FPC board surface is oxidized in the case of soldering components, it is very easy to fall off and be scrapped. Because the finger […]

BGA for SMT processing is a kind of packaging method. BGA is the abbreviation of English BallGridArray, which is translated into Chinese as ball grid array package. In the 1990s, with the continuous development of electronic technology, the processing speed of IC has been continuously improved, and the number of I/O pins on integrated circuit […]

Radio frequency circuit (RF) is called “black art” because of many uncertain factors. However, through practice and exploration, we will find that there are rules to follow. Based on our many years’ working practice and previous experience, we will discuss the circuit board design of RF circuit around these aspects: layout, impedance, lamination, design considerations, […]

The order of wiring design of printed circuit boards in the factory may be different. Before the wiring designer in the factory prepares to design the wiring, it should be clearly specified in his circuit design rules. Today, the circuit board factory tells you the order of wiring design. It is the responsibility of the […]

USB3.0 can provide a data rate of up to 5Gbps, which is ten times faster than high-speed USB(USB2.0) and has improved power efficiency. At this high transmission speed, the signal integrity problem restricts the PCB routing and wiring length and its design and implementation function more and more strictly. Poor signal quality may seriously affect […]

Loongson series processor chips are processor chips developed by Loongson Zhongke Technology Co., Ltd. with independent intellectual property rights. The products are mainly 32-bit and 64-bit single-core and multi-core CPU/SOC, which are mainly for national security, high-end embedded, personal computers, servers and high-performance machines. The product line includes three series: godson-1 small CPU, Godson 2 […]

Silicon micropowder has been widely used in copper clad laminate for more than ten years, and its surface treatment technology has always been a hot topic of inorganic filler used in copper clad laminate. Surface modification of filler: (1) It can reduce the interaction between particles, effectively prevent particle agglomeration, reduce the viscosity of the […]

Huawei’s self-designed HiSilicon K3V2 quad-core processor, clocked at 1.2GHz/1.5GHz The specification of K3V2 quad-core processor is 12*12mm, which is the smallest quad-core processor in the industry at present. At the same time, K3V2 quad-core processor has the strongest embedded GPU in the industry, and uses the highest-end 64-bit bandwidth DDR memory design in mobile phone […]

At present, high-definition network video surveillance has already entered the real high-definition period. At present, there are many brands in the market, and there are also a variety of high-definition chip schemes. How to actually choose them makes customers confused. In the same industry, it is often discussed which product is better at this stage […]

Basic uses of copper clad laminate Copper clad laminate (CCL) is a kind of board made of wood pulp paper or glass fiber cloth as reinforcing material, soaked in resin, covered with copper foil on one side or both sides, and hot pressed. Copper clad laminate (CCL) is the basic material of electronic industry. It […]