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Electronic component surface cleaning and dust removal treatment When plasma technology is applied to circuit board cleaning, because the particles in plasma have a very high speed, it can effectively remove the impurity particles attached to the surface, and its purification effect is better than that of conventional treatment systems. At the same time, plasma […]

Tianjin Feiteng Information Technology Co., Ltd., a subsidiary of China Electronics, is a fast-growing Chinese chip design enterprise, which is mainly engaged in the design, production, sales and service of high-performance and low-power integrated circuit chips, providing users with safe and reliable CPU, ASIC, SoC and other chip products, IP products and system-level solutions based […]

In order to improve and ensure the high-quality welding of electronic circuits, and prevent false welding and virtual welding in circuit welding, it is the key to correctly operate the soldering iron and reasonably select soldering tin and flux, and the treatment of the lead pins of the electronic components to be welded, the proper […]

Haisi series Hi3536 is a professional high-end SoC chip developed for multi-channel HD or multi-channel D1 NVR products. Hi3536 has a built-in high-performance A17 processor and a multi-protocol video decoding engine with up to 16 channels of 1080p decoding capability. It integrates a high-performance video/image processing engine with multiple complex image processing algorithms, and provides […]

Generally, the most commonly used components in SMT package materials are package materials and plug-in materials, and each has its own advantages. Due to the advantages of miniaturization and precision, SMT processing occupies an increasing share in electronic processing, and chip components are the most widely used components in SMT foundry. Compared with plug-in components, […]

This document introduces the characteristics and logic structure of hi3520DV400 chip, describes the functions, working modes and related register definitions of each module in detail, gives the interface timing relationship and related parameters in the form of charts, and describes the pin definitions and uses of the chip, its performance parameters and package size in […]

The process of 8-layer pcb proofing is similar to that of ordinary PCB proofing, but compared with ordinary PCB, there are more pressing processes. Today, Xiaobian will show you the specific process of 8-layer pcb proofing. Brief introduction of the differences between common double-sided pcb and multilayer Pcb; The double panel is the middle layer […]

I. media processing platform (MPP)hi3531/3532 coding 2. Video cache pool: provides large memory management function for media services. Third, the video coding module VENC supports the following protocol coding: (1) H.264 (2) JPEG (3) MJPEG (4) MPEG-4 IV. The input sources of the coding module include three types: (1) the user reads the image file […]

Electromagnetic compatibility design is closely related to specific circuits. In order to design electromagnetic compatibility, PCB designers need to minimize the radiation (RF energy leaking from products) and enhance their susceptibility to radiation (energy entering products) and anti-interference ability. However, for the common conductive coupling at low frequency and the common radiation coupling at high […]

A7@800MHz，32KBI-Cache，32KBD-Cache/128KBL2cache A17@1.25GHz，32KBI-Cache，32KBD-Cache/256KBL2cache HI3519V101 supports Neon acceleration and integrates FPU processing unit. ARM®big.LITTLE core architecture is supported. video coding H.264BP/MP/HP H.265MainProfile H.264/H.265 supports I/P/B frame and double P frame reference. HI3519V101 supports MJPEG/JPEGBaseline encoding HI3519V101 Video Coding Processing Performance H.264/H.265 coding can support the maximum resolution of 16M(4608×3456)Pixel. H.264/H.265 multi-stream real-time coding capability; 340 * 2160 […]