Category Archives: Uncategorized

Design PCB outsourcing instead of painting to improve the radiation interference of SDRAM signal

Some STM32 application customers who use external SDRAM reflect that in EMC test, the radiation interference caused by SDRAM signal exceeds the standard. If the chassis can’t shield the radiation interference in the terminal products, then this kind of problem often needs to be solved by modifying the PCB design of SDRAM signal. Here, how […]

Circuit board design: What are the requirements for the size and shape of PCB?

The simple principle of circuit board design is that it must be suitable for its intended application, not the other way around. Therefore, as a PCB designer, you will find that there are many different PCB size and shape requirements. Here are some ideas about excellent ways to use these different circuit board dimensions. Know […]

Production process of electronic circuit board

In the electronic industry, almost all electrical products will use circuit boards, and PCB is an indispensable electronic component and the heart of all electrical appliances. 1. Evaluation of engineering data of pcb circuit board: customers place orders online, which will be automatically reviewed and quoted by IPCB CAM software independently developed, and the docking […]

SMT technology accelerates and empowers the production of mobile phone wireless charging circuit board

Today’s mass-produced electronic hardware is manufactured using well-known surface mount technology or SMT. There is no reason! In addition to providing many other advantages, SMT wireless charging board S for mobile phones still has a long way to go in speeding up the production speed of wireless charging board for mobile phones. SMT(Surface Mount Technology) […]

Balanced lamination design of PCB

PCB design engineers may design odd-numbered printed circuit boards (PCBs). If wiring doesn’t need an extra layer, why use it? Won’t reducing layers make the circuit board thinner? If the circuit board is one less layer, isn’t the cost lower? However, in some cases, adding one floor will reduce the cost. There are two different […]

Software and hardware design examples of multi-CPU parallel computer system

Multi-CPU parallel computer technology has greatly improved the computing speed of the system, breaking through the limit of single CPU processing speed. At the same time, the single-board computer design with multiple CPUs can reduce the volume of the computer system, the development cost and the development cycle of the system. 1. Hardware design of […]

PCB drawing related questions and answers

1, PCB layout/wiring, the impact on electrical performance is often seen in books about electronics, saying “digital ground wire should be separated from analog ground wire”. Anyone who has laid the board knows that it is difficult in practice. To lay out a better board, first of all, you have to have an electrical understanding […]

Simulation strategy of high-speed PCB design

At present, high-speed PCB design is widely used in communication, computer, graphics and image processing and other fields. In these fields, engineers use different high-speed PCB design strategies, which involve over-design strategies of simulation and analysis. In the field of telecommunications, the design is very complicated, and the transmission speed in data, voice and image […]

High-speed outsourcing PCB design layout

After importing the design data, the PCB design engineer will start the PCB layout design. The quality of layout often determines the success or failure of veneer. What are the layout problems we encountered in those years? Have you laid out the layout and found that there is no room for punching holes? The extra […]

Classification and main characteristics of metal clad laminate

First, the structure and types of metal-based copper clad laminate Metal-based copper clad laminate is generally composed of three parts: metal substrate, insulating dielectric layer and conductive layer (generally copper foil), that is, one or both surfaces of the treated metal substrate are covered with insulating dielectric layer and copper foil, which are compounded by […]