Category Archives: Uncategorized

SMT solder joint shape and its morphological parameters A-898

SMT solder joint shape and its morphological parameters The shape of the solder joint generally refers to the geometric size that the molten solder can reach along the metal surface at the welding junction of the component solder foot and the PCB pad, as well as the contact angle with the metal surface and the […]

SMT solder joint quality and solder joint defects A-899

SMT solder joint quality and solder joint defects For circuit products formed by SMT, the quality of the solder connection points is the main indicator of product quality. The quality of solder joints can generally be judged by whether the solder joints are defective. Solder joint defects are the main manifestation of SMT product assembly […]

Optimized layout design of SMA electronic components A-900

Optimized layout design of SMA electronic components The reliability of the thermal stress of the plate circuit involves the random distribution of electronic components with different power consumption, different shapes, and different materials on the PCB. The position distribution of electronic components may have a great impact on the temperature changes of electronic components. Temperature […]

Analysis of the structure of surface mount circuit modules A-901

Analysis of the structure of surface mount circuit modules When only considering that the structure is subjected to static load, static finite element analysis can be used. However, in actual work, the structure is often subjected to dynamic loads that vary with time. If the dynamic load is large, or although not large, but the […]

SMA dynamic characteristics analysis technology A-902

The dynamic characteristics of SMA include dynamic changes in mechanical and physical properties such as temperature, stress, strain, and electromagnetic compatibility. With the miniaturization of SMA, these dynamic characteristics are becoming more and more sensitive to product assembly quality and performance. It is not only required for scientific design, but also has become indispensable in […]

About reflow soldering temperature curve and its settings A-903

About reflow soldering temperature curve and its settings In the limited welding time, the temperature of the welded product cannot reach thermal equilibrium with the heat source, so infrared and convection reflow welding is a non-equilibrium process. Therefore, the reflow soldering process parameter settings must be suitable for each product design to ensure that the […]

How to strengthen the management of electrostatic protection A904

How to strengthen the management of electrostatic protection Software measures-strengthen the management of electrostatic protection In the production process of electronic products, electrostatic protection is a systematic project that runs through all production links, and is a long-term key task of the factory. On the surface, this project is not suitable for delivering products and […]

SMT production line electrostatic protection A-904

SMT production line electrostatic protection 1. The concept of static electricity and its protection The generation of electrostatic charge is inevitable, such as mutual friction and movement between objects, when two materials are separated, or the flow of liquid and gas will generate charges. Electrons move on the contact surfaces of the two materials, and […]