Category Archives: Uncategorized

SMT patch workshop PCBA board inspection project standard 01, SMT parts welding spot welding 02. Cold welding of the solder joints of SMT parts: use a toothpick to gently touch the pins of the parts, if you can pull it, it is cold welding 03, SMT parts (solder point) short circuit (tin bridge) 04, SMT […]

Selection of chip inductors and component performance testing in SMT chip processing In SMT chip processing, chip inductors mainly play the role of choking, decoupling, filtering and tuning. There are two types of chip inductors, winding type and laminated type. How to choose suitable chip inductors? How should the performance and appearance quality of SMT […]

Detailed explanation of preparation work before SMT patch processing In the SMT production line, the most concerned issue of smt chip processing plant owners is often how to control production costs and improve production efficiency. This involves the problem of the throwing rate of the placement machine. The high throwing rate of SMT placement machine […]

How to solder SMT chip components and lead components SMT chip components are particularly small in size and light in weight, and chip components are easier to solder than lead components. SMD components also have a very important advantage, that is, it improves the stability and reliability of the circuit, and for production, it improves […]

Application example of 6A method in SMT product quality management A manufacturing company decided to use the 6a DMAIC method for analysis and research in view of the high rate of SMT product assembly defects. (1) Problems and goals. Problem: After the reflow process, it is found that there is a higher rate of assembly […]

The necessity of lead-free product SMT circuit board design So far, although the country has not put forward special requirements for the design of lead-free SMT circuit boards, there is no standard for smt circuit boards in the industry, but it advocates environmental protection design, and it is necessary to consider the selection, manufacturing, use, […]

Solution to high throwing rate of smt placement machine In the SMT production line, the most concerned issue of smt chip processing plant owners is often how to control production costs and improve production efficiency. This involves the problem of the throwing rate of the placement machine. The high throwing rate of the SMT placement […]

1. Explanation of common English abbreviations for SMT ACA: Anisotropic Conductive Adhesive ACAF: Anisotropic Conductive Adhesive Film Al: Aluminum (Aluminium) ALIVH: All Inner Via Hole AOI: Automatic Optical Inspection (Automatic Optical Inspection) ASIC: Application Specific Integrated Circuit (Application Specific Integrated Circuit) ATE: Automatic Test Equipment (Automatic Test Equipment) Au: Gold. (Gold) BCB: Benzo Cyclo Butene […]

Common wave soldering process problems during smt patch processing are: non-wetting/semi-wetting, solder balls, disturbed solder joints, cold soldering, tipping, bridging, and virtual soldering. The main reasons are as follows. (1) Non-wetting/semi-wetting Non-wetting refers to the formation of discontinuous solder on the surface of the pad after wave soldering, and sometimes the bare base metal can […]

1. Assembly failure Assembly Fault (Assembly Fault) refers to faults caused by problems in the assembly process, such as solder bridge short circuit, virtual solder open circuit, wrong or missing components, and so on. In actual production, assembly failure, as the main source of failure of SMT products, is the core problem to be solved […]