Category Archives: Uncategorized

1. Assembly failure Assembly Fault (Assembly Fault) refers to faults caused by problems in the assembly process, such as solder bridge short circuit, virtual solder open circuit, wrong or missing components, and so on. In actual production, assembly failure, as the main source of failure of SMT products, is the core problem to be solved […]

SMT assembly manufacturability design Design for Manufacture (DFM: Design for Manufacture) is a design method. Its main idea is to consider the possibility, efficiency and economy of manufacturing at the same time when designing a product, that is, the manufacturability (or processability) of the product. . In this case of simultaneous consideration of design and […]

What is the acceptable standard for the size of tin beads on the PCBA board surface? The following editor of Dongguan pcba processing factory will share for you: Acceptable standards for tin beads: 1. The diameter of the tin ball does not exceed 0.13mm 2. The number of tin beads with a diameter of 0.05mm-0.13mm […]

Safety distance includes electrical clearance (spatial distance), creepage distance (creepage distance) and insulation penetration distance Electric clearance: the shortest distance measured along the air between two adjacent conductors or a conductor and the surface of the adjacent motor casing. Creepage distance: The shortest distance between two adjacent conductors or one conductor and the surface of […]

The placement machine is one of the key equipment of the SMT production line, and it is one of the key factors that determine the degree of automation, assembly accuracy and production efficiency of the assembly system. With the further miniaturization and fine pitch of SMC/SMD, and the introduction of lead-free projects, the performance (precision, […]

Solder paste printing is the most complex and unstable process in the SMT process. It is affected by multiple factors and changes dynamically. Even if the solder paste, printer, and printing parameters are unchanged, the printing quality may vary greatly. . Therefore, it is more and more common to set up inspection stations after printing […]

1. Cleaning agent and its cleaning effect detection The main function of cleaning is to remove residual flux and residues on circuit components to prevent corrosion of the circuit. For SMA products, because of its high assembly density, small gaps between components and PCB, components and components, cleaning is more difficult. After SMA is soldered, […]

Main test items and test methods of incoming adhesive for smt processing 1. Test items for adhesives The role of the adhesive is to ensure that the components can be firmly adhered to the PCB. Starting from the process requirements of SMT, it should have suitable viscosity, low slump, fast curing, moderate bonding strength, high […]

SMT assembly quality is the abbreviation of SMT product assembly quality. It is a description of the degree to which the inherent characteristics involved in the SMT product assembly process and results meet the requirements. It generally refers to the assembly design quality, assembly raw materials (components, PCB, solder paste and other assembly materials) quality, […]