Production efficiency of PCB proofing

PCB proofing production is developing in the direction of high density, high precision, fine aperture, fine wire, fine pitch, high reliability, multilayer, high-speed transmission, light weight and thinness. At the same time, production is developing in the direction of increasing productivity, reducing cost and pollution, and adapting to multi-variety and small batch production. The technical development level of printed circuit is generally represented by line width, aperture and thickness/aperture ratio.
The creator of printed circuit board is Austrian Paul Eisler, who first adopted printed circuit board in radio in 1936. In 1943, Americans mostly applied this technology to military radios. In 1948, the United States officially recognized that this invention could be used for commercial purposes. Since the mid-1950s, printed circuit boards have been widely used.
Before the appearance of PCB, the interconnection between electronic components was completed by direct connection. Nowadays, wires only exist in laboratory for experimental applications; Printed circuit board has definitely occupied an absolute control position in the electronic industry.
PCB proofing production process:
First, contact the manufacturer
First contact the manufacturer, then register the customer number, and someone will quote, place an order and follow up the production progress for you.
Second, the material
Objective: According to the requirements of engineering data MI, cut into small pieces on the large sheet that meets the requirements. Small pieces of sheet that meet the requirements of customers.
Process: large sheet metal → cutting according to MI requirements → curdling → beer rounding → edge grinding → discharging.
Third, drilling
Objective: According to the engineering data, drill the required hole diameter at the corresponding position on the opened sheet with the required size.
Process: stacking pins → upper plate → drilling → lower plate → inspection repair.
Fourth, copper deposition
Objective: Copper deposition is to deposit a thin layer of copper on the insulating hole wall by chemical method.
Process: rough grinding → hanging plate → automatic copper deposition line → lower plate → dipping% dilute H2SO4→ thickening copper.
V. Graphic transfer
Purpose: Graphic transfer is to transfer the image on the production film to the board.
Process: (blue oil process): grinding plate → printing the first side → drying → printing the second side → drying → exposure → image processing → inspection; (Dry film process): hemp board → film pressing → standing → alignment → exposure → standing → developing → inspection.
Sixth, pattern electroplating
Purpose: Pattern electroplating is to electroplate a copper layer with the required thickness and a gold nickel or tin layer with the required thickness on the exposed copper skin or hole wall of the circuit pattern.
Process: upper plate → degreasing → washing twice → micro-etching → washing → pickling → copper plating → washing → pickling → tin plating → washing → lower plate.
Seven, film withdrawal
Objective: To use NaOH solution to recede the plating-resistant coating to expose the non-circuit copper layer.
Process: water film: chajia → alkali soaking → washing → scrubbing → passing through the machine; Dry film: placing plate → passing machine
Eight, etching
Objective: Etching is to use chemical reaction to etch away the copper layer in the non-circuit parts.
Nine, green oil
Objective: Green oil is to transfer the pattern of green oil film to the board, which plays a role in protecting the circuit and preventing the tin on the circuit during parts.
Process: grinding plate → printing photosensitive green oil → curdling plate → exposure → image processing; Grinding → printing the first side → baking → printing the second side → baking.
X. Characters
Purpose: Characters are provided as a mark that can be easily recognized.
Process flow: after finishing with green oil → cooling and standing → adjusting screen → printing characters → finishing.
XI. Gold-plated fingers
Objective: To coat a nickel/gold layer with the required thickness on the finger of the plug to make it more hard and wear-resistant.
Process flow: loading → degreasing → washing twice → micro-etching → washing twice → pickling → copper plating → washing → nickel plating → water washing → gold plating.
Tin plating (a parallel process)
Purpose: Tin spraying is to spray a layer of lead and tin on the exposed copper surface which is not covered with solder resist oil, so as to protect the copper surface from corrosion and oxidation, and ensure good welding performance.
Process: micro-etching → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → washing and air drying.
XII. Molding
Objective: Through mold stamping or numerical control gong machine gong out the shape required by customers, we can use organic gong, beer board, hand gong and hand cutting.
Note: The accuracy of data gong machine board and beer board is higher, followed by hand gong board, and the hand cutting board can only make some simple shapes.
XIII. Testing
Objective: Through electronic 100% test, we can detect defects that affect functionality, such as open circuit and short circuit, which are not easily found by visual inspection.
Process: die loading → board placing → testing → passing →FQC visual inspection → unqualified → repair → returning to testing →OK→REJ→ scrapping.
XIV. Final inspection
Objective: Through 100% visual inspection of plate appearance defects, and repair minor defects, so as to avoid problems and defective plates flowing out.
The specific workflow: incoming materials → checking data → visual inspection → qualified →FQA spot check → qualified → packaging → unqualified → processing → checking OK.