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In the manufacturing stage of SMT SMD factory, the processing technology of lead-free reflow oven has always been a very obvious problem in PCBA production and processing. In the process of SMT chip production, high-quality lead-free solder joints can be produced, which has irreplaceable active effect in the whole process of electronic processing. However, in […]

Many people identify the quality of PCB according to the color of PCB. In fact, the color of motherboard has little to do with the performance of PCB. PCB, it’s not that the taller you look, the better you use it. The color of PCB surface layer is actually the color of solder resist. The […]

PCBA solderless press-in connection technology, also known as press-in technology, consists of malleable deformable or rigid terminals embedded in two or more sides. A kind of “moderate press-in” connection produced by the matching of metallized holes of pcb boards, which produces close point contact between the terminal and the metallized holes, and realizes electrical connection […]

The blowhole caused by PCBA plate welding, which is commonly referred to as bubble, is generally caused by reflow welding and wave welding during PCBA processing. So how to prevent blowhole caused by PCBA production and processing welding? 1. baking Bake PCB and electronic devices exposed to air for a long time to avoid moisture. […]

In the traditional assembly process of electronic devices, the wave soldering technology is generally used for the welding of PCB components with PTH. There are many shortcomings in wave soldering: 1. High-density, fine-spaced chip-mounted components cannot be spread all over the welding surface; 2. More bridging and false welding; 3, need to spray welding flux; […]

Pay attention to the welding temperature After all, the material of aluminum substrate is different. In the case of welding, there is no doubt that we should do a good job in controlling the temperature level, so as to ensure the good welding effect and reasonably prevent certain problems.To ensure that the temperature can achieve […]

In the production process of batch processing of high-precision circuit boards, in order to avoid the problem of rejection and material replenishment of FPC boards caused by too many open and short circuit faults, or the reduction of rough processing problems such as punching, injection molding, laser cutting, etc., and to evaluate how to select […]

The micro-miniaturization, intelligence and intelligent system regulations of the new generation portable electronic equipment promote the application of High-DensityAssemblyPCB board (high-density assembly board) and high-density interconnection (HDI) multilayer circuit boards. The traditional manufacturing process of laminated pcb circuit board can no longer be integrated into the application of ultra-fine particle spacing components, and then the […]

It is the most popular production process in SMT electronic assembly industry, which meets the requirements of thin and mass production of mobile phones and computers. PCBA assembled by SMT patches has high relative density and light weight, and has completed mass production of automation technology. Characteristic spot welding is on the same plane as […]

The package plays the role of installation, fixation, sealing, chip protection and electric heating performance enhancement. In addition, according to the contacts on the chip, the pins are connected to the pins of the packaging case by power lines, and the pins are connected with other components according to the power lines on the printed […]