1. Spacing between patches The spacing between chip components is a problem that engineers must pay attention to in layout. If the spacing is too small, it is very difficult to print solder paste and avoid soldering. Suggested distances are as follows Device distance requirements between patches: Same device: ≥ 0.3mm. Heterogeneous devices: ≥0.13*h+0.3mm(h is […]
Tag Archives: SMT Bowl Feeder ,SMT Radial Feeder .SMT Axial Feeder. auto insertion machine,SMT equipment, AI SMT spare parts
FT-2000/4 process parameters: Compatible with processor core FTC663 with ARMv8 instruction set 4 nuclear 16nm process The main frequency is 2.6 ~ 3.0 GHz 4MBL2Cache, sharing 2MB for every two cores 4MBL3Cache, quad-core sharing Two 72-bit (ECC-supported) DDR 4-3200 storage interfaces Two lanes of 16 lanes (each can be split into 2 x8 lanes), two […]
Electronic component surface cleaning and dust removal treatment When plasma technology is applied to circuit board cleaning, because the particles in plasma have a very high speed, it can effectively remove the impurity particles attached to the surface, and its purification effect is better than that of conventional treatment systems. At the same time, plasma […]
Tianjin Feiteng Information Technology Co., Ltd., a subsidiary of China Electronics, is a fast-growing Chinese chip design enterprise, which is mainly engaged in the design, production, sales and service of high-performance and low-power integrated circuit chips, providing users with safe and reliable CPU, ASIC, SoC and other chip products, IP products and system-level solutions based […]
In order to improve and ensure the high-quality welding of electronic circuits, and prevent false welding and virtual welding in circuit welding, it is the key to correctly operate the soldering iron and reasonably select soldering tin and flux, and the treatment of the lead pins of the electronic components to be welded, the proper […]
PCB design is very important for power circuit design, and it is also one of the necessary technologies for beginners. In this article, Xiaobian will share some highlights about PCB design. PCB structure design In this step, according to the determined circuit board size and various mechanical positioning, the PCB board surface is drawn in […]
Generally, the most commonly used components in SMT package materials are package materials and plug-in materials, and each has its own advantages. Due to the advantages of miniaturization and precision, SMT processing occupies an increasing share in electronic processing, and chip components are the most widely used components in SMT foundry. Compared with plug-in components, […]
This document introduces the characteristics and logic structure of hi3520DV400 chip, describes the functions, working modes and related register definitions of each module in detail, gives the interface timing relationship and related parameters in the form of charts, and describes the pin definitions and uses of the chip, its performance parameters and package size in […]
The process of 8-layer pcb proofing is similar to that of ordinary PCB proofing, but compared with ordinary PCB, there are more pressing processes. Today, Xiaobian will show you the specific process of 8-layer pcb proofing. Brief introduction of the differences between common double-sided pcb and multilayer Pcb; The double panel is the middle layer […]
I. media processing platform (MPP)hi3531/3532 coding 2. Video cache pool: provides large memory management function for media services. Third, the video coding module VENC supports the following protocol coding: (1) H.264 (2) JPEG (3) MJPEG (4) MPEG-4 IV. The input sources of the coding module include three types: (1) the user reads the image file […]