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Calculation method of number and cost of SMT chip processing

At present, the main products of SMT are: lead-free soldering process, lead soldering process and red glue soldering process. Moreover, its point calculation method is very similar, but many users don’t know much about the calculation of SMT patch points and how to calculate the cost. Some companies calculate one pad as one point, but […]

PCB multi-layer PCB proofing requirements

Nowadays, the use of PCB multilayer circuit boards in the market has become a popular trend, and with the development of the industry, the ability of many PCB manufacturers to develop and produce PCB multilayer circuit boards has become increasingly prominent. So, what are the requirements for the proofing of PCB multilayer circuit boards? Below, […]

What are the difficulties encountered in pcb proofing?

Printed circuit boards (pcbs) are generally called printed circuit boards (PCBs). Printed circuit board proofing means that a small amount of samples are produced for testing before mass production, which also answers the question of PCB proofing sold in the market. Many electronic product manufacturers will find some professional PCB proofing manufacturers to cooperate with, […]

There are differences between lead and lead-free technology in SMT process.

Generally, there are two kinds of SMT processes, one is lead-free process and the other is lead-containing process. Everyone knows that lead is harmful to people, so lead-free process meets the requirements of environmental protection and is the general trend. Shenzhen Yingcheng Electronic SMT SMD foundry adopts lead-free technology. The difference between lead-containing process and […]

Component shift in smt process

In fact, the displacement of components in smt processing is a bad phenomenon in SMT factory. With the development of science and technology and the improvement of people’s living standard, the pursuit of electronic products is becoming more and more miniaturized and precise. However, the traditional DIP plug-in in SMT small batch chip processing factory […]

Usage of pcb pad and via in

For some customers, the design of PCB is seriously nonstandard, and they simply can’t tell whether it’s pad or via. Sometimes conductive holes are treated with pad, and sometimes key holes are treated with via. The design confusion leads to more errors. According to incomplete statistics, the problems caused by nonstandard design account for more […]

Principle of condensation welding in SMT processing

Gas reflow welding is also called condensation welding. VPS refers to SMT SMD welding equipment that uses the latent heat released by the vaporization of fluorocarbon liquid as a heat medium to provide heat for welding. First-phase reflow thick film circuit. 1. The principle of gas-phase reflow soldering is that the liquid containing fluorocarbon can […]

Micro-assembly technology of SMT proofing in small batch

In fact, the micro-assembly technology of SMT proofing and small batch processing is a comprehensive technology of assembling various micro-components of electronic circuits on high-density multilayer interconnected substrates by micro-welding and SMT chip processing to form micro-electronic products. I. Multi-chip module The multi-chip component in SMT package is a kind of high-tech electronic product derived […]

Methods, Advantages and Disadvantages of Manufacturing Steel Mesh in Changsha SMT Small Batch Patch Processing Factory

At the beginning, the manufacturing process of steel mesh in Changsha SMT small batch processing factory is mainly to make plates by photography, and then chemical etching is used. In addition, laser cutting or electroforming is used to make plates for steel mesh in Changsha SMT processing. Changsha smt proofing briefly introduces the advantages and […]

How to reduce the throwing rate in smt processing

SMT material throwing is usually called material throwing, that is to say, after the suction nozzle of the mounter picks up the material in the material tray, the material is thrown out in the process of moving to the PCB mounting position. Generally, the reason for this problem is that the suction nozzle pressure is […]