Disclaimer: The following methods are not applicable to all designs. Facing different designs, engineers need to choose the appropriate methods to deal with them. In the process of PCB design, high-multilayer, high-density designs are often encountered, so cross-segmentation is inevitable in this case, as shown in the following figure: This is an HDI project, which […]
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29
Sep
Sep
As electronic products continue to be miniaturized, as more functions are loaded into smaller devices, the heat dissipation requirements of these systems also increase. This is especially true for PCBs operating at high current. Especially the power supply system with heavy load, such as lithium-ion batteries used in electric vehicles, needs a power management system […]
29
Sep
Sep
With the improvement of the integration of IC devices, the miniaturization of devices and the increasing speed of devices, the EMI problem in electronic products is becoming more and more serious. From the point of view of EMC/EMI design of system equipment, dealing with EMC/EMI problems in PCB design stage of equipment is the most […]