Tag Archives: Wave Soldering Defects & Tips for PCB .Through Hole Soldering Defects .Wave Solder Finger

Wave Soldering Defects & Tips for PCB .Through Hole Soldering Defects .Wave Solder Finger

1. Oxidation or contamination of the soldering terminals, pins, and pads of the printed circuit board substrate, or the PCB pads are damp. 2. The adhesion of the metal electrode of the inductor terminal is poor or the single-layer electrode is used, which will cause the capping phenomenon at the welding temperature. 3. In the […]