Author Archives: allaismt

In the traditional assembly process of electronic devices, the wave soldering technology is generally used for the welding of PCB components with PTH. There are many shortcomings in wave soldering: 1. High-density, fine-spaced chip-mounted components cannot be spread all over the welding surface; 2. More bridging and false welding; 3, need to spray welding flux; […]

Nowadays, more and more circuit boards use surface mount components. Compared with traditional packaging, it can reduce the total area of circuit boards, facilitate mass production and processing, and have high wiring density. The lead inductance of chip resistor and capacitor is greatly reduced, which has great advantages in high frequency circuit. The inconvenience of […]

Nowadays, with people’s living standard getting higher and higher, there are more and more home appliances. Television is a very common electrical appliance in people’s daily life, and it is also an electrical appliance that almost every household has, with a very high popularization rate. So do you know what the logic board in TV […]

Definition of making high frequency circuit board High-frequency circuit board refers to a special circuit board with high electromagnetic frequency, which is used for PCB in high-frequency (frequency greater than 300MHZ or wavelength less than 1m) and microwave (frequency greater than 3GHZ or wavelength less than 0.1m) fields. It is a circuit board produced by […]

IGBT master control board is a kind of master control board with a power range of 15KW-120KW, which consists of a panel, a master control board and two driving boards. It is mainly used in the heat treatment industry. Introduction of IGBT main control board: The main control board of high-frequency induction heating and two […]

In the production process of batch processing of high-precision circuit boards, in order to avoid the problem of rejection and material replenishment of FPC boards caused by too many open and short circuit faults, or the reduction of rough processing problems such as punching, injection molding, laser cutting, etc., and to evaluate how to select […]

The micro-miniaturization, intelligence and intelligent system regulations of the new generation portable electronic equipment promote the application of High-DensityAssemblyPCB board (high-density assembly board) and high-density interconnection (HDI) multilayer circuit boards. The traditional manufacturing process of laminated pcb circuit board can no longer be integrated into the application of ultra-fine particle spacing components, and then the […]

The package plays the role of installation, fixation, sealing, chip protection and electric heating performance enhancement. In addition, according to the contacts on the chip, the pins are connected to the pins of the packaging case by power lines, and the pins are connected with other components according to the power lines on the printed […]

In the production process of FPC, if you don’t pay attention to touching the PCB pads with your fingers, especially the FPC with surface treatment, it will cause oxidation. When the FPC board surface is oxidized in the case of soldering components, it is very easy to fall off and be scrapped. Because the finger […]

BGA for SMT processing is a kind of packaging method. BGA is the abbreviation of English BallGridArray, which is translated into Chinese as ball grid array package. In the 1990s, with the continuous development of electronic technology, the processing speed of IC has been continuously improved, and the number of I/O pins on integrated circuit […]