Author Archives: allaismt

Production process of HDI buried blind hole circuit board

1. Brief introduction, blind holes and embedded fillers are mainly made of high-density and small microplates. Purpose depends on saving circuit space, so as to reduce PCB volume, such as mobile phone board. Second, classification: 1). Laser drilling, 1. the reason for drilling with laser: a. customer data requires drilling with laser; B because the […]

Design Scheme and Characteristics of Loongson 1F

Loongson 1F chip is a cost-effective single-chip system based on GS232 processor core, which can be widely used in industrial control, home gateway, information appliances, medical devices and security applications. Loongson 1F is realized by SMIC 0.13 micron process and packaged in Wire Bond BGA448. Loongson 1F chip features: Integrated with a GS232 dual-launch Loongson […]

Parameter characteristics of Hi3559AV100ES processor

It provides multi-channel video recording, video recording and video support of hik1358h265 code output or movie level raw data output, and integrated with high-performance ISP processing, while using advanced low-power technology and low-power architecture design, can be applied to multi-functional motion camera, UAV all-in-one, professional camera and VR camera. Hi3559av100es supports multi-channel 4ksensor input, multi-channel […]

Essence of overall PCb design thinking

PCB design is very important for power circuit design, and it is also one of the necessary technologies for beginners. In this article, Xiaobian will share some highlights about PCB design. PCB structure design In this step, according to the determined circuit board size and various mechanical positioning, the PCB board surface is drawn in […]

What architecture does Feiteng cpu adopt?

Domestic Feiteng has reached the level of international mainstream processors a few years ago. When Feiteng 2000 appeared, the opportunity of Feiteng appeared. Without a strong software background, the development of domestic cpu is slow, and it is impossible to develop effectively for a long time. It is very difficult to rely on China’s current […]

Tianjin Feiteng FT-1500 Series and FT-2000A Series Processor Chips

Tianjin Feiteng Information Technology Co., Ltd., a subsidiary of China Electronics, is a fast-growing Chinese chip design enterprise, which is mainly engaged in the design, production, sales and service of high-performance and low-power integrated circuit chips, providing users with safe and reliable CPU, ASIC, SoC and other chip products, IP products and system-level solutions based […]

Activation of the front surface of PCB flexible board after removing glue residue and solder resist characters

Electronic component surface cleaning and dust removal treatment When plasma technology is applied to circuit board cleaning, because the particles in plasma have a very high speed, it can effectively remove the impurity particles attached to the surface, and its purification effect is better than that of conventional treatment systems. At the same time, plasma […]

FT-2000/4 Process Parameters and Application

FT-2000/4 process parameters: Compatible with processor core FTC663 with ARMv8 instruction set 4 nuclear 16nm process The main frequency is 2.6 ~ 3.0 GHz 4MBL2Cache, sharing 2MB for every two cores 4MBL3Cache, quad-core sharing Two 72-bit (ECC-supported) DDR 4-3200 storage interfaces Two lanes of 16 lanes (each can be split into 2 x8 lanes), two […]

What are the requirements for PCB spacing?

In the ordinary PCB design, we will encounter all kinds of safe spacing problems, such as the spacing between vias and pads, the spacing between traces, and so on, which we should consider. In PCB design, we divide these spaces into two categories: Electrical spacing Non-electrical safety spacing I. PCB design electrical safety spacing 1. […]

Pcb12 circuit tips for layout

1. Spacing between patches The spacing between chip components is a problem that engineers must pay attention to in layout. If the spacing is too small, it is very difficult to print solder paste and avoid soldering. Suggested distances are as follows Device distance requirements between patches: Same device: ≥ 0.3mm. Heterogeneous devices: ≥0.13*h+0.3mm(h is […]