Author Archives: allaismt

Development strategy of sea processor scheme

The chips designed by HiSilicon cover a wide range, including wifi networks, fixed networks, digital media and other fields, but the most concerned and highly concerned ones are processor chips, including mobile phone processor SoC, server chips and its AI chips. On the technical level and threshold, the mobile phone with processor is obviously the […]

Production process of HDI buried blind hole circuit board

1. Brief introduction, blind holes and embedded fillers are mainly made of high-density and small microplates. Purpose depends on saving circuit space, so as to reduce PCB volume, such as mobile phone board. Second, classification: 1). Laser drilling, 1. the reason for drilling with laser: a. customer data requires drilling with laser; B because the […]

Design Scheme and Characteristics of Loongson 1F

Loongson 1F chip is a cost-effective single-chip system based on GS232 processor core, which can be widely used in industrial control, home gateway, information appliances, medical devices and security applications. Loongson 1F is realized by SMIC 0.13 micron process and packaged in Wire Bond BGA448. Loongson 1F chip features: Integrated with a GS232 dual-launch Loongson […]

Parameter characteristics of Hi3559AV100ES processor

It provides multi-channel video recording, video recording and video support of hik1358h265 code output or movie level raw data output, and integrated with high-performance ISP processing, while using advanced low-power technology and low-power architecture design, can be applied to multi-functional motion camera, UAV all-in-one, professional camera and VR camera. Hi3559av100es supports multi-channel 4ksensor input, multi-channel […]

What architecture does Feiteng cpu adopt?

Domestic Feiteng has reached the level of international mainstream processors a few years ago. When Feiteng 2000 appeared, the opportunity of Feiteng appeared. Without a strong software background, the development of domestic cpu is slow, and it is impossible to develop effectively for a long time. It is very difficult to rely on China’s current […]

Measures to prevent false welding in circuit welding

In order to improve and ensure the high-quality welding of electronic circuits, and prevent false welding and virtual welding in circuit welding, it is the key to correctly operate the soldering iron and reasonably select soldering tin and flux, and the treatment of the lead pins of the electronic components to be welded, the proper […]

Tianjin Feiteng FT-1500 Series and FT-2000A Series Processor Chips

Tianjin Feiteng Information Technology Co., Ltd., a subsidiary of China Electronics, is a fast-growing Chinese chip design enterprise, which is mainly engaged in the design, production, sales and service of high-performance and low-power integrated circuit chips, providing users with safe and reliable CPU, ASIC, SoC and other chip products, IP products and system-level solutions based […]

Activation of the front surface of PCB flexible board after removing glue residue and solder resist characters

Electronic component surface cleaning and dust removal treatment When plasma technology is applied to circuit board cleaning, because the particles in plasma have a very high speed, it can effectively remove the impurity particles attached to the surface, and its purification effect is better than that of conventional treatment systems. At the same time, plasma […]

What are the requirements for PCB spacing?

In the ordinary PCB design, we will encounter all kinds of safe spacing problems, such as the spacing between vias and pads, the spacing between traces, and so on, which we should consider. In PCB design, we divide these spaces into two categories: Electrical spacing Non-electrical safety spacing I. PCB design electrical safety spacing 1. […]

Pcb12 circuit tips for layout

1. Spacing between patches The spacing between chip components is a problem that engineers must pay attention to in layout. If the spacing is too small, it is very difficult to print solder paste and avoid soldering. Suggested distances are as follows Device distance requirements between patches: Same device: ≥ 0.3mm. Heterogeneous devices: ≥0.13*h+0.3mm(h is […]