Category Archives: Uncategorized

Many people identify the quality of PCB according to the color of PCB. In fact, the color of motherboard has little to do with the performance of PCB. PCB, it’s not that the taller you look, the better you use it. The color of PCB surface layer is actually the color of solder resist. The […]

PCBA solderless press-in connection technology, also known as press-in technology, consists of malleable deformable or rigid terminals embedded in two or more sides. A kind of “moderate press-in” connection produced by the matching of metallized holes of pcb boards, which produces close point contact between the terminal and the metallized holes, and realizes electrical connection […]

The blowhole caused by PCBA plate welding, which is commonly referred to as bubble, is generally caused by reflow welding and wave welding during PCBA processing. So how to prevent blowhole caused by PCBA production and processing welding? 1. baking Bake PCB and electronic devices exposed to air for a long time to avoid moisture. […]

Nowadays, more and more circuit boards use surface mount components. Compared with traditional packaging, it can reduce the total area of circuit boards, facilitate mass production and processing, and have high wiring density. The lead inductance of chip resistor and capacitor is greatly reduced, which has great advantages in high frequency circuit. The inconvenience of […]

IGBT master control board is a kind of master control board with a power range of 15KW-120KW, which consists of a panel, a master control board and two driving boards. It is mainly used in the heat treatment industry. Introduction of IGBT main control board: The main control board of high-frequency induction heating and two […]

In the production process of batch processing of high-precision circuit boards, in order to avoid the problem of rejection and material replenishment of FPC boards caused by too many open and short circuit faults, or the reduction of rough processing problems such as punching, injection molding, laser cutting, etc., and to evaluate how to select […]

The micro-miniaturization, intelligence and intelligent system regulations of the new generation portable electronic equipment promote the application of High-DensityAssemblyPCB board (high-density assembly board) and high-density interconnection (HDI) multilayer circuit boards. The traditional manufacturing process of laminated pcb circuit board can no longer be integrated into the application of ultra-fine particle spacing components, and then the […]

It is the most popular production process in SMT electronic assembly industry, which meets the requirements of thin and mass production of mobile phones and computers. PCBA assembled by SMT patches has high relative density and light weight, and has completed mass production of automation technology. Characteristic spot welding is on the same plane as […]

The package plays the role of installation, fixation, sealing, chip protection and electric heating performance enhancement. In addition, according to the contacts on the chip, the pins are connected to the pins of the packaging case by power lines, and the pins are connected with other components according to the power lines on the printed […]

In the production process of FPC, if you don’t pay attention to touching the PCB pads with your fingers, especially the FPC with surface treatment, it will cause oxidation. When the FPC board surface is oxidized in the case of soldering components, it is very easy to fall off and be scrapped. Because the finger […]