Category Archives: Uncategorized

Influence of small finger print on fpc flexible circuit board production

In the production process of FPC, if you don’t pay attention to touching the PCB pads with your fingers, especially the FPC with surface treatment, it will cause oxidation. When the FPC board surface is oxidized in the case of soldering components, it is very easy to fall off and be scrapped. Because the finger […]

What is BGA in SMT processing?

BGA for SMT processing is a kind of packaging method. BGA is the abbreviation of English BallGridArray, which is translated into Chinese as ball grid array package. In the 1990s, with the continuous development of electronic technology, the processing speed of IC has been continuously improved, and the number of I/O pins on integrated circuit […]

High frequency circuit board production proofing

Definition of making high frequency circuit board High-frequency circuit board refers to a special circuit board with high electromagnetic frequency, which is used for PCB in high-frequency (frequency greater than 300MHZ or wavelength less than 1m) and microwave (frequency greater than 3GHZ or wavelength less than 0.1m) fields. It is a circuit board produced by […]

Loongson processor history and scheme development strategy

Loongson series processor chips are processor chips developed by Loongson Zhongke Technology Co., Ltd. with independent intellectual property rights. The products are mainly 32-bit and 64-bit single-core and multi-core CPU/SOC, which are mainly for national security, high-end embedded, personal computers, servers and high-performance machines. The product line includes three series: godson-1 small CPU, Godson 2 […]

Surface modification of ultrafine silicon powder produced by copper clad laminate

Silicon micropowder has been widely used in copper clad laminate for more than ten years, and its surface treatment technology has always been a hot topic of inorganic filler used in copper clad laminate. Surface modification of filler: (1) It can reduce the interaction between particles, effectively prevent particle agglomeration, reduce the viscosity of the […]

Customized development of Huawei HiSilicon quad-core processor scheme

Huawei’s self-designed HiSilicon K3V2 quad-core processor, clocked at 1.2GHz/1.5GHz The specification of K3V2 quad-core processor is 12*12mm, which is the smallest quad-core processor in the industry at present. At the same time, K3V2 quad-core processor has the strongest embedded GPU in the industry, and uses the highest-end 64-bit bandwidth DDR memory design in mobile phone […]

Huawei HiSilicon Chip Design Scheme

At present, high-definition network video surveillance has already entered the real high-definition period. At present, there are many brands in the market, and there are also a variety of high-definition chip schemes. How to actually choose them makes customers confused. In the same industry, it is often discussed which product is better at this stage […]

The role of copper clad laminate in pcb industry chain

Basic uses of copper clad laminate Copper clad laminate (CCL) is a kind of board made of wood pulp paper or glass fiber cloth as reinforcing material, soaked in resin, covered with copper foil on one side or both sides, and hot pressed. Copper clad laminate (CCL) is the basic material of electronic industry. It […]

Process treatment of display circuit board

There are several treatment processes for the surface of LED circuit board: smooth board (without any treatment on the surface), rosin board, OSP (organic solder protective agent, slightly better than rosin), tin spraying (lead-tin and lead-free tin), gold-plated board, gold-deposited board, etc. These are more noticeable. Difference between gold deposition process and gold plating process […]

Manufacturing process of LED circuit board

The basic steps of led manufacturing: welding-self-inspection-mutual inspection-cleaning-rubbing. Here’s a small series to give you a detailed introduction. 1. welding of led circuit board ① Judging the direction of the lamp: the front is facing upwards, and the side where the black rectangle is located is the negative end; ② The direction of the circuit […]