What are the main steps of the SMT solder joint stress analysis method Establish material stress-deformation relational database The material stress-deformation relational database is an important content of the input data for stress analysis design, which is directly related to the accuracy of stress analysis. The establishment of a material stress-deformation relational database is a […]
Category Archives: Uncategorized
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(1) Solder joint shape modeling and forming design The mathematical model of the SMT solder joint shape is the basis of the solder joint forming design. Whether it is correct or not and whether the modeling method is appropriate is the key to the success of the solder joint shape research. The establishment of the […]
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SMT solder joint shape design 1. SMT solder joint shape CAD The solder joint shape design includes the geometric parameter design of the solder joint shape, as well as the geometric size and geometric shape design of the component solder foot and PCB pad, as well as the PCB material, soldering temperature, flux and other […]
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SMT solder joint shape and its morphological parameters The shape of the solder joint generally refers to the geometric size that the molten solder can reach along the metal surface at the welding junction of the component solder foot and the PCB pad, as well as the contact angle with the metal surface and the […]
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SMT solder joint quality and solder joint defects For circuit products formed by SMT, the quality of the solder connection points is the main indicator of product quality. The quality of solder joints can generally be judged by whether the solder joints are defective. Solder joint defects are the main manifestation of SMT product assembly […]
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Optimized layout design of SMA electronic components The reliability of the thermal stress of the plate circuit involves the random distribution of electronic components with different power consumption, different shapes, and different materials on the PCB. The position distribution of electronic components may have a great impact on the temperature changes of electronic components. Temperature […]
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Analysis of the structure of surface mount circuit modules When only considering that the structure is subjected to static load, static finite element analysis can be used. However, in actual work, the structure is often subjected to dynamic loads that vary with time. If the dynamic load is large, or although not large, but the […]
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The dynamic characteristics of SMA include dynamic changes in mechanical and physical properties such as temperature, stress, strain, and electromagnetic compatibility. With the miniaturization of SMA, these dynamic characteristics are becoming more and more sensitive to product assembly quality and performance. It is not only required for scientific design, but also has become indispensable in […]
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About reflow soldering temperature curve and its settings In the limited welding time, the temperature of the welded product cannot reach thermal equilibrium with the heat source, so infrared and convection reflow welding is a non-equilibrium process. Therefore, the reflow soldering process parameter settings must be suitable for each product design to ensure that the […]
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How to strengthen the management of electrostatic protection Software measures-strengthen the management of electrostatic protection In the production process of electronic products, electrostatic protection is a systematic project that runs through all production links, and is a long-term key task of the factory. On the surface, this project is not suitable for delivering products and […]