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Inspection and countermeasures of SMT defective products There are two main phenomena of missing components caused by the placement machine: ①The components are taken away after placement; ②The components fall off due to the movement of the X-YI table after placement. The smaller the ratio of the contact area between the component and the printed […]

How to solve the mounting failure of SMT production line (1) Observe the degree of failure phenomenon (2) Summarize the environment and conditions for the occurrence of undesirable phenomena, etc. ①Whether it occurs on a specific component; ②Whether it occurs in a specific batch; ③Whether it occurs on a specific machine; ④Whether it happened at […]

smt assembly common faults SMC/SMD placement is a key process in the assembly and production of SMT products. Automatic placement is the main method of SMC/SMD placement. Placement machines are essential equipment in the assembly line of SMT products, as well as key equipment of SMT. It is the main factor that determines the degree […]

smt patch and its main fault 1. SMD and its main faults SMC/SMD placement is a key process in the assembly and production of SMT products. Automatic placement is the main method of SMC/SMD placement. The placement machine is an essential equipment in the assembly line of SMT products, and is also a key equipment […]

SMT processing solder paste application fault elimination countermeasures Solder paste printing is a relatively complex process technology, which is affected by both materials and printing equipment and process parameters. The soldering quality defects of most SMT products are directly or spaced from the solder paste printing process. Although the quality of solder paste printing can […]

Patch glue application failure and its application quality control countermeasures 1. SMD glue application and its main faults SMD glue is used as a bonding agent and is often used in wave soldering as the glue for SMC/SMD to be placed on the substrate. Adhesive coating can use dispenser dispensing (also known as syringe dispensing) […]

Smt product assembly failure and its types 1. Smt product assembly failure Assembly Fault (Assembly Fault) refers to faults caused by problems in the assembly process, such as solder bridge short circuit, virtual solder open circuit, wrong or missing components, and so on. In actual production, assembly failure, as the main source of failure of […]

Function test of smt assembly quality inspection Although a variety of new detection technologies emerge endlessly, such as optical and X-ray inspection, electrical performance testing based on flying probes or needle beds, etc., functional testing is still the main method to detect and ensure the final functional quality of products. At present, there are more […]

There are several smta measurement methods Typical non-vector testing methods are as follows: (1) Semiconductor junction (PN junction) test At present, when most digital integrated circuits are produced, they will consider the internal core functions and the protection factors of each signal input and output pin to ground, such as anti-static measures. In the semiconductor […]

Common problems in PCB circuit design 1. Stacking of pads 1. The stacking of pads (except surface mount pads) means the stacking of holes. During the drilling process, the drill bit will be broken due to multiple drilling in one place, resulting in damage to the hole. 2. Two holes in the multilayer board are […]