The thermal conductivity of led substrate is related to the insulation layer (usually PP, thermal grease, etc.) inside the aluminum substrate, and it is one of the three criteria to measure the quality of aluminum substrate (thermal resistance and withstand voltage are the other two properties). The thermal conductivity of aluminum substrates can be measured […]
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Generally, the heat dissipation design of aluminum substrate LED is based on fluid dynamics software simulation and basic design. Resistance of fluid flow: due to the viscosity of fluid and the influence of solid boundary, the fluid is subjected to resistance in the flow process. This resistance is called flow resistance, which can be divided […]
When most hardware engineers contact PCB layout tools, PADS, Allgero, Protel and other tools from the beginning, they will inevitably contact the packaging and manufacturing of components. Whether it’s SMD components, QFP, QFN, BGA, PGA, SOT23, TO263, MOIC and other chips, or passive components such as 0402, 0603, 0805, etc., all have to touch the […]
Flexible circuit board features: (1)FPC is small in size and light in weight. (2)FPC can be moved, bent and twisted. (3)FPC has excellent electrical properties, dielectric properties and heat resistance. (4)FPC has high assembly reliability and operability. (5)FPC can be installed with three-position connection. (6)FPC is beneficial to heat diffusion. […]
Simply put, reflow soldering actually means that there is a heating power supply circuit in the soldering furnace, which heats the gas or N2 to a sufficiently high temperature and blows it to the pcb board where the components have already been pasted, so that the solder on both sides of the components can be […]
Nowadays, the factors considered in pcb design are more and more complicated, such as clock, crosstalk, impedance, inspection, manufacturing and processing technology, which often urges the design staff to repeatedly carry out a lot of reasonable layout, certification, maintenance and other work. On-line editor of main parameter bundle can compile this main parameter into formula […]
Flexible printed circuit board. The number of circuits in one FPC can exceed 100, but it only occupies the thickness of 0.2mm Although it is more expensive than flat cable, it is widely used in smart products with compact volume. Especially mobile phones, smart bracelets and other scenes. Today, the most important thing for everyone […]
“High-speed backplane and high-speed backplane connector” is mentioned in “The culprits in several high-speed PCB designs”. So how is the high-speed backplane designed? What are the design steps from beginning to end? What are the key points in each stage? The case analysis of the current period is summarized. High-speed backplane design process The detailed […]
1. Multi-layer circuit board Jafani bites copper This problem must be traced back to the copper electroplating process. It is found that if the examples of deep hole barrel plating and buried hole barrel plating with high thickness-diameter ratio can be shown that the copper thickness is more evenly distributed, this kind of Jafani’s copper […]
With the popularization of SMT technology, SMT chip processing factory has strict requirements on packaging methods, coplanarity of pins and solderability of components, which leads to differences between reliability, manufacturability and reliability inspection of components in SMT production assembly line, and it is SMT chip with the formulation and implementation of production planning. Problems that […]










