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Solution to the technical problems of lead-free reflow soldering in SMT factory

In the manufacturing stage of SMT SMD factory, the processing technology of lead-free reflow oven has always been a very obvious problem in PCBA production and processing. In the process of SMT chip production, high-quality lead-free solder joints can be produced, which has irreplaceable active effect in the whole process of electronic processing. However, in […]

Influence of PCB design color on performance

Many people identify the quality of PCB according to the color of PCB. In fact, the color of motherboard has little to do with the performance of PCB. PCB, it’s not that the taller you look, the better you use it. The color of PCB surface layer is actually the color of solder resist. The […]

PCBA solderless press-in connection technology and plate

PCBA solderless press-in connection technology, also known as press-in technology, consists of malleable deformable or rigid terminals embedded in two or more sides. A kind of “moderate press-in” connection produced by the matching of metallized holes of pcb boards, which produces close point contact between the terminal and the metallized holes, and realizes electrical connection […]

Prevention skills of welding blowhole in PCBA processing

The blowhole caused by PCBA plate welding, which is commonly referred to as bubble, is generally caused by reflow welding and wave welding during PCBA processing. So how to prevent blowhole caused by PCBA production and processing welding? 1. baking Bake PCB and electronic devices exposed to air for a long time to avoid moisture. […]

PTH process of PCBA welding technology

In the traditional assembly process of electronic devices, the wave soldering technology is generally used for the welding of PCB components with PTH. There are many shortcomings in wave soldering: 1. High-density, fine-spaced chip-mounted components cannot be spread all over the welding surface; 2. More bridging and false welding; 3, need to spray welding flux; […]

Traditional manual welding of aluminum substrate

Pay attention to the welding temperature After all, the material of aluminum substrate is different. In the case of welding, there is no doubt that we should do a good job in controlling the temperature level, so as to ensure the good welding effect and reasonably prevent certain problems.To ensure that the temperature can achieve […]

Several common packaging methods of components

The package plays the role of installation, fixation, sealing, chip protection and electric heating performance enhancement. In addition, according to the contacts on the chip, the pins are connected to the pins of the packaging case by power lines, and the pins are connected with other components according to the power lines on the printed […]

Influence of small finger print on fpc flexible circuit board production

In the production process of FPC, if you don’t pay attention to touching the PCB pads with your fingers, especially the FPC with surface treatment, it will cause oxidation. When the FPC board surface is oxidized in the case of soldering components, it is very easy to fall off and be scrapped. Because the finger […]

What is BGA in SMT processing?

BGA for SMT processing is a kind of packaging method. BGA is the abbreviation of English BallGridArray, which is translated into Chinese as ball grid array package. In the 1990s, with the continuous development of electronic technology, the processing speed of IC has been continuously improved, and the number of I/O pins on integrated circuit […]

High frequency circuit board production proofing

Definition of making high frequency circuit board High-frequency circuit board refers to a special circuit board with high electromagnetic frequency, which is used for PCB in high-frequency (frequency greater than 300MHZ or wavelength less than 1m) and microwave (frequency greater than 3GHZ or wavelength less than 0.1m) fields. It is a circuit board produced by […]